summary:

The epoxy heating substrate is a thin-layer element with certain thickness composed of resistance chip and epoxy board insulation carrier produced by etching foil. Nickel chromium alloy foil is applied to the glass fiber board of high temperature resistant insulating carrier, and then pressed by high temperature with glass fiber sheet (plate thickness ≥ 0.05mm), which has good rigidity and toughness, After the glass fiber heating substrate is electrified and heated, infrared heat is generated, forming a thermal radiation source for heating.

characteristic:

1. heating speed is fast: the heating substrate has a larger effective heat conduction area than the wound heating plate, and there is a small temperature gradient between the heating substrate and the heat sink, and the heater keeps a lower temperature;
   

   
   

2. corrosion resistance and moisture resistance: because the heating chip of the substrate is wrapped by the insulation material resistant to temperature, it has the characteristics of good waterproof performance, chemical corrosion resistance and not easy to aging, thus avoiding the damp and corrosion;
   

   
   

3. safety: the carrier and the opposite materials are made of flame retardant materials, with large area of heat dissipation (heat transfer) of components, and no open fire and extra high temperature area;
   

   
   

4. the substrate is a surface heat source, and it is heated by plane radiation, and the heating uniformity can reach 85%. It provides more uniform heat field than traditional filament and linear electric heating element, and the power load is lower than that of traditional filament electric heating element;
   

   
   

5. the positive temperature coefficient heater has self limiting temperature characteristics. The higher the temperature, the smaller the power is, on the contrary, the power is large and the temperature compensation is fast;
   

   
   

6. the product is very thin (thickness ≤ 0.2mm), with good heat transfer effect, and the actual heating temperature is very close to the workpiece, and the thermal resistance and thermal inertia are relatively small, and the temperature is easy to control;
   

   
   

7. the product is rigid and has good support. It can be supported by wooden frame, plastic support and various metal supports. The heating area cannot be attached to the support. The expansion space and upper and lower circulation cooling channel shall be reserved to prevent deformation or temperature caused by excessive expansion coefficient during operation, which will cause the base plate to burn out;
   

   
   

8. pressure sensitive adhesive can be used to bond flat and smooth workpiece; The maximum temperature of pressure sensitive adhesive is: 150C continuous, 180C instant, and the working density is not;
   

   
   

9. the substrate coated with pressure sensitive adhesive should be used within half a year after delivery, otherwise the use performance of glue will be affected;
   

1. the product must be equipped with reliable fuse and temperature protection device to prevent the danger caused by the failure caused by abnormal operation of the product.